Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB33XN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB33XNSOT1220DFN2020MD-67.07691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340668691157126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560080.000000.79131
PolymerAcrylic resinProprietary0.0140020.000000.19783
subTotal0.07000100.000000.98914
DieAluminium alloyAluminium (Al)7429-90-50.000450.280000.00633
Doped siliconSilicon (Si)7440-21-30.1595599.720002.25454
subTotal0.16000100.000002.26087
Lead FrameCopper alloyCopper (Cu)7440-50-82.6865492.9600037.96210
Magnesium (Mg)7439-95-40.004050.140000.05717
Nickel (Ni)7440-02-00.083812.900001.18427
Silicon (Si)7440-21-30.018210.630000.25727
Pure metal layerGold (Au)7440-57-50.001440.050000.02042
Nickel (Ni)7440-02-00.087863.040001.24145
Palladium (Pd)7440-05-30.008090.280000.11434
subTotal2.89000100.0000040.83702
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000012.12252
Silica fused60676-86-02.2380060.0000031.62397
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.111903.000001.58120
Ion trapping agentBismuth (Bi)7440-69-90.018650.500000.26353
PigmentCarbon black1333-86-40.018650.500000.26353
PolymerEpoxy resin systemProprietary0.261107.000003.68946
Phenolic resinProprietary0.223806.000003.16240
subTotal3.73000100.0000052.70661
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00133
Tin solderTin (Sn)7440-31-50.1699099.940002.40074
subTotal0.17000100.000002.40218
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalGold (Au)7440-57-50.0068899.990000.09721
subTotal0.00688100.000000.09722
WirePure metalGold (Au)7440-57-50.05003100.000000.70692
subTotal0.05003100.000000.70692
total7.07691100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.