Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMXB120EPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMXB120EPESOT1215DFN1010D-31.287832 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340671541474126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02400080.0000001.863597
PolymerAcrylic resinProprietary0.00600020.0000000.465899
subTotal0.030000100.0000002.329496
DieDoped siliconSilicon (Si)7440-21-30.160000100.00000012.423981
subTotal0.160000100.00000012.423981
Lead FrameCopper alloyChromium (Cr)7440-47-30.0012720.2400000.098771
Copper (Cu)7440-50-80.50090394.51000038.895058
Tin (Sn)7440-31-50.0012720.2400000.098771
Zinc (Zn)7440-66-60.0011130.2100000.086424
Pure metal layerGold (Au)7440-57-50.0003710.0700000.028808
Nickel (Ni)7440-02-00.0229494.3300001.781987
Palladium (Pd)7440-05-30.0021200.4000000.164618
subTotal0.530000100.00000041.154436
Mould CompoundFillerSilica -amorphous-7631-86-90.11730023.0000009.108331
Silica fused60676-86-00.30600060.00000023.760863
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153003.0000001.188043
Ion trapping agentBismuth (Bi)7440-69-90.0025500.5000000.198007
PigmentCarbon black1333-86-40.0025500.5000000.198007
PolymerEpoxy resin systemProprietary0.0357007.0000002.772101
Phenolic resinProprietary0.0306006.0000002.376086
subTotal0.510000100.00000039.601439
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000105
Non hazardousProprietary0.0000170.0555000.001293
Tin solderTin (Sn)7440-31-50.02998299.9400002.328099
subTotal0.030000100.0000002.329496
WireImpurityNon hazardousProprietary0.0000030.0100000.000216
Pure metalGold (Au)7440-57-50.02782999.9900002.160935
subTotal0.027832100.0000002.161151
total1.287832100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.