Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN1R2-30YLD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN1R2-30YLDSOT669LFPAK85.51000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340682351152126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.30000100.000003.85920
subTotal3.30000100.000003.85920
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867625.83953
Iron (Fe)7439-89-60.005000.099910.00584
Phosphorus (P)7723-14-00.001620.032470.00190
subTotal5.00000100.000005.84727
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100044.24976
Iron (Fe)7439-89-60.056860.150000.06650
Phosphorus (P)7723-14-00.015160.040000.01773
subTotal37.91000100.0000044.33399
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.07216
Flame retardantZinc Borate138265-88-02.2530010.000002.63478
PigmentCarbon black1333-86-40.067590.300000.07904
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.19052
Phenolic resinProprietary2.027709.000002.37130
subTotal22.53000100.0000026.34780
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00045
Tin alloyTin (Sn)7440-31-53.8496299.990004.50195
subTotal3.85000100.000004.50240
Solder PasteLead alloyLead (Pb)7439-92-15.5130092.500006.44720
Silver (Ag)7440-22-40.149002.500000.17425
Tin (Sn)7440-31-50.298005.000000.34850
subTotal5.96000100.000006.96995
Solder PasteImpurityAntimony (Sb)7440-36-00.002090.030000.00244
Lead alloyLead (Pb)7439-92-16.4359192.470007.52650
Silver (Ag)7440-22-40.174002.500000.20348
Tin (Sn)7440-31-50.348005.000000.40697
subTotal6.96000100.000008.13939
total85.51000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.