Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN1R6-25YLE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN1R6-25YLESOT669LFPAK98.120000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346640651152126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.600000100.0000000.611496
subTotal0.600000100.0000000.611496
ClipCopper alloyCopper (Cu)7440-50-827.34520099.80000027.869140
Iron (Fe)7439-89-60.0411000.1500000.041887
Phosphorus (P)7723-14-00.0137000.0500000.013962
subTotal27.400000100.00000027.924990
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000038.562955
Iron (Fe)7439-89-60.0568650.1500000.057955
Phosphorus (P)7723-14-00.0151640.0400000.015455
subTotal37.910000100.00000038.636364
Mould CompoundFillerSilica fused60676-86-013.96860062.00000014.236241
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-23.49215015.5000003.559060
ImpuritySilicon Dioxide (SiO2)14808-60-70.0450600.2000000.045923
PigmentCarbon black1333-86-40.1126500.5000000.114808
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.4506002.0000000.459234
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.47830011.0000002.525785
Phenolic resinProprietary1.9826408.8000002.020628
subTotal22.530000100.00000022.961680
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.000392
Tin alloyTin (Sn)7440-31-53.84961599.9900003.923374
subTotal3.850000100.0000003.923767
Solder PasteLead alloyLead (Pb)7439-92-11.52625092.5000001.555493
Silver (Ag)7440-22-40.0412502.5000000.042040
Tin (Sn)7440-31-50.0825005.0000000.084081
subTotal1.650000100.0000001.681614
Solder PasteImpurityAntimony (Sb)7440-36-00.0012540.0300000.001278
Lead alloyLead (Pb)7439-92-13.86524692.4700003.939305
Silver (Ag)7440-22-40.1045002.5000000.106502
Tin (Sn)7440-31-50.2090005.0000000.213004
subTotal4.180000100.0000004.260090
total98.120000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.