Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN2R5-30YL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN2R5-30YLSOT669LFPAK82.12000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340630711158126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.80000100.000003.40964
subTotal2.80000100.000003.40964
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867626.08059
Iron (Fe)7439-89-60.005000.099910.00608
Phosphorus (P)7723-14-00.001620.032470.00198
subTotal5.00000100.000006.08865
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100046.07644
Iron (Fe)7439-89-60.056860.150000.06925
Phosphorus (P)7723-14-00.015160.040000.01847
subTotal37.91000100.0000046.16416
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.73563
Flame retardantZinc Borate138265-88-02.2530010.000002.74355
PigmentCarbon black1333-86-40.067590.300000.08231
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.40479
Phenolic resinProprietary2.027709.000002.46919
subTotal22.53000100.0000027.43547
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00047
Tin alloyTin (Sn)7440-31-53.8496299.990004.68779
subTotal3.85000100.000004.68826
Solder PasteLead alloyLead (Pb)7439-92-19.2777592.5000011.29780
Silver (Ag)7440-22-40.250752.500000.30535
Tin (Sn)7440-31-50.501505.000000.61069
subTotal10.03000100.0000012.21384
total82.12000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.