Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN3R0-30YL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN3R0-30YLSOT669LFPAK78.31000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340630721158126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.50000100.000003.19244
subTotal2.50000100.000003.19244
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867626.37643
Iron (Fe)7439-89-60.005000.099910.00638
Phosphorus (P)7723-14-00.001620.032470.00207
subTotal5.00000100.000006.38488
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100048.31819
Iron (Fe)7439-89-60.056860.150000.07262
Phosphorus (P)7723-14-00.015160.040000.01936
subTotal37.91000100.0000048.41017
Mould CompoundFillerSilica fused60676-86-013.7433061.0000017.54987
Flame retardantZinc Borate138265-88-02.2530010.000002.87703
PigmentCarbon black1333-86-40.067590.300000.08631
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.66774
Phenolic resinProprietary2.027709.000002.58932
subTotal22.53000100.0000028.77027
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00049
Tin alloyTin (Sn)7440-31-53.8496299.990004.91587
subTotal3.85000100.000004.91636
Solder PasteLead alloyLead (Pb)7439-92-16.0310092.500007.70144
Silver (Ag)7440-22-40.163002.500000.20815
Tin (Sn)7440-31-50.326005.000000.41629
subTotal6.52000100.000008.32588
total78.31000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.