Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN4R0-40YS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN4R0-40YSSOT669LFPAK84.97040 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340639371156126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-37.55040100.000008.88592
subTotal7.55040100.000008.88592
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867625.87661
Iron (Fe)7439-89-60.005000.099910.00588
Phosphorus (P)7723-14-00.001620.032470.00191
subTotal5.00000100.000005.88440
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100044.53077
Iron (Fe)7439-89-60.056860.150000.06692
Phosphorus (P)7723-14-00.015160.040000.01785
subTotal37.91000100.0000044.61554
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.17422
Flame retardantZinc Borate138265-88-02.2530010.000002.65151
PigmentCarbon black1333-86-40.067590.300000.07955
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.22348
Phenolic resinProprietary2.027709.000002.38636
subTotal22.53000100.0000026.51512
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00045
Tin alloyTin (Sn)7440-31-53.8496299.990004.53054
subTotal3.85000100.000004.53099
Solder PasteLead alloyLead (Pb)7439-92-17.5202592.500008.85043
Silver (Ag)7440-22-40.203252.500000.23920
Tin (Sn)7440-31-50.406505.000000.47840
subTotal8.13000100.000009.56803
total84.97040100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.