Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN4R1-30YLC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN4R1-30YLCSOT669LFPAK77.24000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340651951158126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.10000100.000001.42413
subTotal1.10000100.000001.42413
ClipCopper alloyCopper (Cu)7440-50-84.9900099.800006.46038
Iron (Fe)7439-89-60.007500.150000.00971
Phosphorus (P)7723-14-00.002500.050000.00324
subTotal5.00000100.000006.47333
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100048.98753
Iron (Fe)7439-89-60.056860.150000.07362
Phosphorus (P)7723-14-00.015160.040000.01963
subTotal37.91000100.0000049.08078
Mould CompoundFillerSilica fused60676-86-013.7433061.0000017.79298
Flame retardantZinc Borate138265-88-02.2530010.000002.91688
PigmentCarbon black1333-86-40.067590.300000.08751
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.74626
Phenolic resinProprietary2.027709.000002.62519
subTotal22.53000100.0000029.16882
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00050
Tin alloyTin (Sn)7440-31-53.8496299.990004.98397
subTotal3.85000100.000004.98447
Solder PasteLead alloyLead (Pb)7439-92-11.9055092.500002.46699
Silver (Ag)7440-22-40.051502.500000.06668
Tin (Sn)7440-31-50.103005.000000.13335
subTotal2.06000100.000002.66702
Solder PasteImpurityAntimony (Sb)7440-36-00.001440.030000.00186
Lead alloyLead (Pb)7439-92-14.4293192.470005.73448
Silver (Ag)7440-22-40.119752.500000.15504
Tin (Sn)7440-31-50.239505.000000.31007
subTotal4.79000100.000006.20145
total77.24000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.