Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN9R1-30YL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN9R1-30YLSOT669LFPAK88.51000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340649481155126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.83000100.000000.93775
subTotal0.83000100.000000.93775
ClipCopper alloyCopper (Cu)7440-50-819.9740099.8700022.56694
Iron (Fe)7439-89-60.020000.100000.02260
Phosphorus (P)7723-14-00.006000.030000.00678
subTotal20.00000100.0000022.59632
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100042.74994
Iron (Fe)7439-89-60.056860.150000.06425
Phosphorus (P)7723-14-00.015160.040000.01713
subTotal37.91000100.0000042.83132
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.52740
Flame retardantZinc Borate138265-88-02.2530010.000002.54548
PigmentCarbon black1333-86-40.067590.300000.07636
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.01459
Phenolic resinProprietary2.027709.000002.29093
subTotal22.53000100.0000025.45476
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00043
Tin alloyTin (Sn)7440-31-53.8496299.990004.34936
subTotal3.85000100.000004.34979
Solder PasteLead alloyLead (Pb)7439-92-13.1357592.500003.54282
Silver (Ag)7440-22-40.084752.500000.09575
Tin (Sn)7440-31-50.169505.000000.19150
subTotal3.39000100.000003.83007
total88.51000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.