Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PTVS33VP1BPL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934667839118PTVS33VP1BPLJPTVS33VP1BPLSOD128FL-1 (CFP5-FL)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 38730 ppm of the article. SCIP No. f5efb503-80b8-43e3-8e6e-08e214eea1a7.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 2704 ppm; substance 7439-92-1: 38731 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 2703 ppm; substance 7439-92-1: 38730 ppm; substance 7440-43-9: <1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 1047 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-36.840000100.00000016.748286
Die Total6.840000100.00000016.748286
ClipCopper alloyCopper (Cu)7440-50-83.01426299.8100007.380661
ClipCopper alloyIron (Fe)7439-89-60.0045300.1500000.011092
ClipCopper alloyPhosphorus (P)7723-14-00.0012080.0400000.002958
Clip Total3.020000100.0000007.394711
Lead FrameCopper alloyCopper (Cu)7440-50-810.64972799.81000026.076706
Lead FrameCopper alloyIron (Fe)7439-89-60.0160050.1500000.039190
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0042680.0400000.010451
Lead Frame Total10.670000100.00000026.126347
Mould CompoundFillerSilica fused60676-86-016.68880090.70000040.863860
Mould CompoundPolymerEpoxy resin system0.9568005.2000002.342801
Mould CompoundPolymerPhenol Formaldehyde resin (generic)9003-35-40.6440003.5000001.576885
Mould CompoundPigmentCarbon black1333-86-40.1104000.6000000.270323
Mould Compound Total18.400000100.00000045.053869
Post-PlatingTin alloyTin (Sn)7440-31-50.19990699.9529000.489485
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000300.0150000.000073
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000190.0096000.000047
Post-PlatingImpurityCopper (Cu)7440-50-80.0000160.0080000.000039
Post-PlatingImpurityIron (Fe)7439-89-60.0000140.0070000.000035
Post-PlatingImpurityArsenic (As)7440-38-20.0000050.0025000.000013
Post-PlatingImpurityLead (Pb)7439-92-10.0000050.0025000.000012
Post-PlatingImpurityZinc (Zn)7440-66-60.0000020.0010000.000005
Post-PlatingImpurityAluminium (Al)7429-90-50.0000020.0010000.000005
Post-PlatingImpurityCadmium (Cd)7440-43-90.0000010.0005000.000002
Post-Plating Total0.200000100.0000000.489716
Solder PasteLead alloyLead (Pb)7439-92-11.58175092.5000003.873040
Solder PasteLead alloyTin (Sn)7440-31-50.0855005.0000000.209354
Solder PasteLead alloySilver (Ag)7440-22-40.0427502.5000000.104677
Solder Paste Total1.710000100.0000004.187071
PTVS33VP1BPL Total40.840000100.000000100.000000
Notes
Report created on 2024-11-20 08:40:22 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-11-20 08:40:22 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material		 有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
半导体芯片 (Die)◯◯◯◯◯◯
夹子 (Clip)◯◯◯◯◯◯
引线框架 (Lead Frame)◯◯◯◯◯◯
模封料 (Mould Compound)◯◯◯◯◯◯
后镀层 (Post-Plating)◯◯◯◯◯◯
锡膏 (Solder Paste)✕◯◯◯◯◯
◯ 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕ 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限（EFUP）。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-11-20 08:40:22 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.