Chemical content PTVS4V8Z1UPC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934665952515	PTVS4V8Z1UPCZ	PTVS4V8Z1UPC	SOD1610-1 (DFN1610-2)	RFS	1
934665952343	PTVS4V8Z1UPCAZ	PTVS4V8Z1UPC	SOD1610-1 (DFN1610-2)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 32 ppm; substance 1333-86-4: 1002 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 32 ppm; substance 1333-86-4: 1002 ppm; substance 7440-43-9: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 41994 ppm; substance 7440-57-5: 44 ppm; substance 7440-05-3: 388 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.104652	91.800000	3.886424
Adhesive	Polymer	Resin system		0.009348	8.200000	0.347154
		Adhesive Total		0.114000	100.000000	4.233578

Die	Doped silicon	Silicon (Si)	7440-21-3	0.230000	100.000000	8.541428
		Die Total		0.230000	100.000000	8.541428

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.813391	96.487570	30.206582
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.019389	2.300000	0.720043
Lead Frame	Copper alloy	Zinc (Zn)	7440-66-6	0.000843	0.100000	0.031306
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.000843	0.100000	0.031306
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.000084	0.010000	0.003131
Lead Frame	Impurity	Tin (Sn)	7440-31-5	0.000020	0.002430	0.000761
Lead Frame	Impurity	Non-declarable		0.000001	0.000100	0.000031
		Base Alloy Total		0.834571	99.000100	30.993160
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.008429	0.999900	0.313032
		Pre-Plating Total		0.008429	0.999900	0.313032
		Lead Frame Total		0.843000	100.000000	31.306192

Mould Compound	Filler	Silica fused	60676-86-0	1.175850	87.100000	43.667121
Mould Compound	Polymer	Epoxy resin system		0.078300	5.800000	2.907799
Mould Compound	Hardener	Phenolic resin		0.055620	4.120000	2.065541
Mould Compound	Additive	Non-declarable		0.029700	2.200000	1.102959
Mould Compound	Filler	Silica	7631-86-9	0.005400	0.400000	0.200539
Mould Compound	Pigment	Carbon black	1333-86-4	0.002700	0.200000	0.100270
Mould Compound	Additive	Non-declarable		0.002430	0.180000	0.090243
		Mould Compound Total		1.350000	100.000000	50.134472

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.121990	99.991800	4.530299
Post-Plating	Tin alloy	Lead (Pb)	7439-92-1	0.000004	0.003500	0.000159
Post-Plating	Tin alloy	Arsenic (As)	7440-38-2	0.000002	0.000500	0.000022
Post-Plating	Tin alloy	Bismuth (Bi)	7440-69-9	0.000002	0.001700	0.000077
Post-Plating	Tin alloy	Iron (Fe)	7439-89-6	0.000001	0.000800	0.000035
Post-Plating	Tin alloy	Antimony (Sb)	7440-36-0	0.000001	0.000900	0.000041
Post-Plating	Tin alloy	Zinc (Zn)	7440-66-6	0.000000	0.000100	0.000005
Post-Plating	Tin alloy	Cadmium (Cd)	7440-43-9	0.000000	0.000300	0.000014
Post-Plating	Tin alloy	Aluminium (Al)	7429-90-5	0.000000	0.000100	0.000005
Post-Plating	Tin alloy	Copper (Cu)	7440-50-8	0.000000	0.000300	0.000014
		Post-Plating Total		0.122000	100.000000	4.530671

Wire	Copper alloy	Copper (Cu)	7440-50-8	0.032590	96.540348	1.210296
Wire	Impurity	Non-declarable		0.000003	0.009659	0.000119
Wire	Impurity	Non-declarable		0.000000	0.000998	0.000011
Wire	Impurity	Non-declarable		0.000000	0.000998	0.000011
Wire	Pure metal layer	Gold (Au)	7440-57-5	0.000119	0.348998	0.004373
		Wire Coating 1 Total		0.000119	0.348998	0.004373
Wire	Pure metal layer	Palladium (Pd)	7440-05-3	0.001046	3.098999	0.038849
		Wire Coating 2 Total		0.001046	3.098999	0.038849
		Wire Total		0.033758	100.000000	1.253659

		PTVS4V8Z1UPC Total		2.692758	100.000000	100.000000

Notes
Report created on 2024-12-18 14:39:01 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-18 14:39:01 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层 (Pre-Plating)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
导线涂层1 (Wire Coating 1)	◯	◯	◯	◯	◯	◯
导线涂层2 (Wire Coating 2)	◯	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-18 14:39:01 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content PTVS4V8Z1UPC

Bipolar transistors

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Analog & Logic ICs

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Chemical content PTVS4V8Z1UPC