Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUMZ1

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUMZ1SOT363SC-885.452926 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340342201151312601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000000.733551
subTotal0.040000100.0000000.733551
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000000.733551
subTotal0.040000100.0000000.733551
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018630.0900000.034165
Carbon (C)7440-44-00.0008280.0400000.015185
Chromium (Cr)7440-47-30.0043470.2100000.079719
Cobalt (Co)7440-48-40.0089010.4300000.163233
Iron (Fe)7439-89-60.98118047.40000017.993642
Manganese (Mn)7439-96-50.0175950.8500000.322671
Nickel (Ni)7440-02-00.73919735.71000013.555970
Phosphorus (P)7723-14-00.0004140.0200000.007592
Silicon (Si)7440-21-30.0053820.2600000.098699
Sulphur (S)7704-34-90.0004140.0200000.007592
Pure metal layerCopper (Cu)7440-50-80.27137713.1100004.976723
Silver (Ag)7440-22-40.0385021.8600000.706080
subTotal2.070000100.00000037.961271
Mould CompoundFillerSilica fused60676-86-02.19292075.10000040.215473
PigmentCarbon black1333-86-40.0087600.3000000.160648
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51100017.5000009.371116
Phenol Formaldehyde resin (generic)9003-35-40.2073207.1000003.801995
subTotal2.920000100.00000053.549232
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000204
Bismuth (Bi)7440-69-90.0000040.0010000.000068
Copper (Cu)7440-50-80.0000040.0010000.000068
Lead (Pb)7439-92-10.0000180.0050000.000339
Tin solderTin (Sn)7440-31-50.36996399.9900006.784669
subTotal0.370000100.0000006.785348
WirePure metalCopper (Cu)7440-50-80.012926100.0000000.237042
subTotal0.012926100.0000000.237042
total5.452926100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.