Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PZU884LS-C2V7-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PZU884LS-C2V7-QSOD882BDDFN1006-20.89148 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934667031315212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.61978
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22315
Phenolic resinProprietary0.0025713.530000.28836
subTotal0.01900100.000002.13129
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.36519
subTotal0.03000100.000003.36519
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.35877
Magnesium (Mg)7439-95-40.000590.150000.06646
Nickel (Ni)7440-02-00.011772.980001.32039
Silicon (Si)7440-21-30.002570.650000.28800
Pure metal layerGold (Au)7440-57-50.000040.010000.00443
Nickel (Ni)7440-02-00.002250.570000.25256
Palladium (Pd)7440-05-30.000160.040000.01772
subTotal0.39500100.0000044.30833
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.78645
Silica fused60676-86-00.3387980.0920038.00300
PigmentCarbon black1333-86-40.003930.928000.44033
PolymerEpoxy resin systemProprietary0.035748.450004.00946
Phenolic resinProprietary0.010792.550001.20995
subTotal0.42300100.0000047.44919
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00125
Tin solderTin (Sn)7440-31-50.0199999.940002.24211
subTotal0.02000100.000002.24346
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0044899.990000.50248
subTotal0.00448100.000000.50253
total0.89148100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.