Chemical content SMBJ13A

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934668123118	SMBJ13AJ	SMBJ13A	SOD1002-1 (SMB)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 27010 ppm of the article. SCIP No. bf714fc9-5e43-4a1e-8d5f-b2a30aab8ecb.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 7(c)-I: 'Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 10(a): 'Electrical and electronic components, which contain lead in a glass or ceramic, in a glass or ceramic matrix compound, in a glass-ceramic material, or in a glass-ceramic matrix compound.'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 65997-17-3: 135 ppm; substance 7440-02-0: 1536 ppm; substance 1333-86-4: 6146 ppm; substance 7439-92-1: 27010 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 65997-17-3: 135 ppm; substance 7440-02-0: 1536 ppm; substance 1333-86-4: 6146 ppm; substance 7439-92-1: 27010 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 730 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	2.346120	90.179890	2.443870
Die	Lead borosilicate glass	Lead Borosilicate Glass (generic)	65997-17-3	0.013010	0.500080	0.013550
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.051770	1.989930	0.053930
		Die Metallization 1 Total		0.051770	1.989930	0.053930
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.043190	1.660130	0.044990
		Die Metallization 2 Total		0.043190	1.660130	0.044990
Die	Pure metal layer	Nickel (Ni)	7440-02-0	0.147510	5.669970	0.153660
		Die Metallization 3 Total		0.147510	5.669970	0.153660
		Die Total		2.601600	100.000000	2.710000

Clip	Copper alloy	Copper (Cu)	7440-50-8	8.591960	99.887926	8.949960
Clip	Copper alloy	Iron (Fe)	7439-89-6	0.007230	0.084057	0.007530
Clip	Copper alloy	Phosphorus (P)	7723-14-0	0.002410	0.028017	0.002510
		Clip Total		8.601600	100.000000	8.960000

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	20.981270	99.888030	21.855486
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.017640	0.083980	0.018377
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.005880	0.027990	0.006127
		Lead Frame Total		21.004790	100.000000	21.879990

Mould Compound	Filler	Silica fused	60676-86-0	51.331390	86.999981	53.470201
Mould Compound	Polymer	Epoxy resin system		1.770050	3.000002	1.843802
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	1.770050	3.000002	1.843802
Mould Compound	Polymer	Phenolic resin		1.770050	3.000002	1.843802
Mould Compound	Filler	Silica -amorphous-	7631-86-9	1.770050	3.000001	1.843802
Mould Compound	Pigment	Carbon black	1333-86-4	0.590020	1.000012	0.614601
		Mould Compound Total		59.001610	100.000000	61.460010

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	1.987200	100.000000	2.070000
		Post-Plating Total		1.987200	100.000000	2.070000

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	2.592960	92.500000	2.701000
Solder Paste	Lead alloy	Tin (Sn)	7440-31-5	0.140160	5.000000	0.146000
Solder Paste	Lead alloy	Silver (Ag)	7440-22-4	0.070080	2.500000	0.073000
		Solder Paste Total		2.803200	100.000000	2.920000

		SMBJ13A Total		96.000000	100.000000	100.000000

Notes
Report created on 2024-12-18 14:39:38 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-18 14:39:38 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
半导体芯片 (Die)	✕	◯	◯	◯	◯	◯
半导体芯片金属化层1 (Die Metallization 1)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层2 (Die Metallization 2)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层3 (Die Metallization 3)	◯	◯	◯	◯	◯	◯
夹子 (Clip)	◯	◯	◯	◯	◯	◯
引线框架 (Lead Frame)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
锡膏 (Solder Paste)	✕	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-18 14:39:38 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content SMBJ13A

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content SMBJ13A