2PA1774xMB series
Parametrics
| Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2PA1774QMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250.0 | -40.0 | -100.0 | 120.0 | 270.0 | 150 | 100.0 | Y |
| 2PA1774RMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250.0 | -40.0 | -100.0 | 180.0 | 390.0 | 150 | 100.0 | Y |
| 2PA1774SMB | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | PNP | 250.0 | -40.0 | -100.0 | 270.0 | 560.0 | 150 | 100.0 | Y |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 2PA1774QMB | 2PA1774QMB,315 (934065894315) |
Active | 0100 0000 |
DFN1006B-3 (SOT883B) |
SOT883B |
REFLOW_BG-BD-1
|
SOT883B_315 |
| 2PA1774RMB | 2PA1774RMB,315 (934065895315) |
Active | 0000 1101 |
DFN1006B-3 (SOT883B) |
SOT883B |
REFLOW_BG-BD-1
|
SOT883B_315 |
| 2PA1774SMB | 2PA1774SMB,315 (934065896315) |
Active | 0000 1110 |
DFN1006B-3 (SOT883B) |
SOT883B |
REFLOW_BG-BD-1
|
SOT883B_315 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 2PA1774QMB | 2PA1774QMB,315 | 2PA1774QMB |
|
|
| 2PA1774RMB | 2PA1774RMB,315 | 2PA1774RMB |
|
|
| 2PA1774SMB | 2PA1774SMB,315 | 2PA1774SMB |
|
|
Documentation (6)
| File name | Title | Type | Date |
|---|---|---|---|
| 2PA1774XMB_SER | 40 V, 100 mA PNP general-purpose transistors | Data sheet | 2018-08-28 |
| SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1006B-3_SOT883B_mk | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1 mm x 0.6 mm x 0.37 mm body | Marcom graphics | 2017-01-28 |
| SOT883B | plastic, leadless ultra small plastic package; 3 solder lands; 0.35 mm pitch; 1.0 mm x 0.6 mm x 0.37 mm body | Package information | 2022-05-20 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT883B | 3D model for products with SOT883B package | Design support | 2020-01-22 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.