74AHCV244A
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74AHCV244APW | 1.8 - 5.5 | CMOS | ± 16 | 60 | 8 | low | -40~125 | TSSOP20 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AHCV244APW | 74AHCV244APWJ (935308263118) |
Active | AHV244A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AHCV244APW | 74AHCV244APWJ | 74AHCV244APW |
Documentation (7)
File name | Title | Type | Date |
---|---|---|---|
74AHCV244A | Octal buffer/line driver; 3-state | Data sheet | 2023-09-25 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
ahcv244a | ahcv244a IBIS model | IBIS model | 2017-06-02 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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