74AVC8T245-Q100
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| 74AVC8T245BQ-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 8 | very low | -40~125 | DHVQFN24 |
| 74AVC8T245PW-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 8 | very low | -40~125 | TSSOP24 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AVC8T245BQ-Q100 | 74AVC8T245BQ-Q100J (935300551118) |
Active | AVC8T245 |
DHVQFN24 (SOT815-1) |
SOT815-1 | SOT815-1_118 | |
| 74AVC8T245PW-Q100 | 74AVC8T245PW-Q100J (935300549118) |
Active | AVC8T245 |
TSSOP24 (SOT355-1) |
SOT355-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT355-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AVC8T245BQ-Q100 | 74AVC8T245BQ-Q100J | 74AVC8T245BQ-Q100 |
|
|
| 74AVC8T245PW-Q100 | 74AVC8T245PW-Q100J | 74AVC8T245PW-Q100 |
|
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Documentation (10)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AVC8T245_Q100 | 8-bit dual supply translating transceiver with configurable voltage translation; 3-state | Data sheet | 2024-06-25 |
| SOT815-1 | 3D model for products with SOT815-1 package | Design support | 2019-10-03 |
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
| avc8t245 | avc8t245 IBIS model | IBIS model | 2021-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN24_SOT815-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 3.5 mm x 5.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | Package information | 2021-08-17 |
| SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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