74HC165-Q100; 74HCT165-Q100
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name | |||
---|---|---|---|---|---|---|---|---|---|---|---|
74HC165BQ-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 16 | 56 | low | -40~125 | DHVQFN16 | |||
74HC165D-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 16 | 56 | low | -40~125 | SO16 | |||
74HC165PW-Q100 | 2.0 - 6.0 | CMOS | ± 5.2 | 16 | 56 | low | -40~125 | 123 | 4.2 | 52.9 | TSSOP16 |
74HCT165BQ-Q100 | 4.5 - 5.5 | TTL | ± 4 | 14 | 48 | low | -40~125 | DHVQFN16 | |||
74HCT165D-Q100 | 4.5 - 5.5 | TTL | ± 4 | 14 | 48 | low | -40~125 | 91 | 8.9 | 50 | SO16 |
74HCT165PW-Q100 | 4.5 - 5.5 | TTL | ± 4 | 15 | 48 | low | -40~125 | TSSOP16 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74HC165BQ-Q100 | 74HC165BQ-Q100,115 (935298766115) |
Active | HC165 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74HC165D-Q100 | 74HC165D-Q100,118 (935298767118) |
Active | 74HC165D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74HC165PW-Q100 | 74HC165PW-Q100,118 (935298768118) |
Active | HC165 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
74HCT165BQ-Q100 | 74HCT165BQ-Q100,11 (935298769115) |
Active | HCT165 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74HCT165D-Q100 | 74HCT165D-Q100,118 (935298771118) |
Active | 74HCT165D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74HCT165PW-Q100 | 74HCT165PW-Q100,11 (935298772118) |
Active | HCT165 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74HC165BQ-Q100 | 74HC165BQ-Q100,115 | 74HC165BQ-Q100 | ||
74HC165D-Q100 | 74HC165D-Q100,118 | 74HC165D-Q100 | ||
74HC165PW-Q100 | 74HC165PW-Q100,118 | 74HC165PW-Q100 | ||
74HCT165BQ-Q100 | 74HCT165BQ-Q100,11 | 74HCT165BQ-Q100 | ||
74HCT165D-Q100 | 74HCT165D-Q100,118 | 74HCT165D-Q100 | ||
74HCT165PW-Q100 | 74HCT165PW-Q100,11 | 74HCT165PW-Q100 |
Documentation (19)
File name | Title | Type | Date |
---|---|---|---|
74HC_HCT165_Q100 | 8-bit parallel-in/serial out shift register | Data sheet | 2024-05-30 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
hc165 | 74HC165 IBIS model | IBIS model | 2015-09-14 |
hct165 | 74HCT165 IBIS model | IBIS model | 2015-09-14 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
hc165 | 74HC165 IBIS model | IBIS model | 2015-09-14 |
hct165 | 74HCT165 IBIS model | IBIS model | 2015-09-14 |
Ordering, pricing & availability
Sample
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