74LVC138A-Q100
3-to-8 line decoder/demultiplexer; inverting
The 74LVC138A-Q100 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The 74LVC138A features three enable inputs (E1, E2 and E3). Every output will be HIGH unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion of the 74LVC138A-Q100 to a 1-of-32 (5 to 32 lines) decoder with just four 74LVC138A-Q100 ICs and one inverter. The 74LVC138A-Q100 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Overvoltage tolerant inputs to 5.5 V
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
Direct interface with TTL levels
Demultiplexing capability
Multiple input enable for easy expansion
Ideal for memory chip select decoding
Mutually exclusive outputs
Output drive capability 50 Ω transmission lines at 125 °C
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|
| 74LVC138ABQ-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.7 | low | -40~125 | DHVQFN16 |
| 74LVC138AD-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.7 | low | -40~125 | SO16 |
| 74LVC138APW-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.7 | low | -40~125 | TSSOP16 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC138ABQ-Q100 | 74LVC138ABQ-Q100X (935301409115) |
Active | VC138A |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74LVC138AD-Q100 | 74LVC138AD-Q100J (935300918118) |
Active | 74LVC138AD |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74LVC138APW-Q100 | 74LVC138APW-Q100J (935300919118) |
Active | LVC138A |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC138ABQ-Q100 | 74LVC138ABQ-Q100X | 74LVC138ABQ-Q100 |
|
|
| 74LVC138AD-Q100 | 74LVC138AD-Q100J | 74LVC138AD-Q100 |
|
|
| 74LVC138APW-Q100 | 74LVC138APW-Q100J | 74LVC138APW-Q100 |
|
|
Documentation (20)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC138A_Q100 | 3-to-8 line decoder/demultiplexer; inverting | Data sheet | 2024-02-12 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc138a | lvc138a IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc138a | lvc138a IBIS model | IBIS model | 2013-04-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
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