BCP55-Q series
Parametrics
| Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BCP55-10-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 60.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 | Y |
| BCP55-16-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 60.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
| BCP55-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | NPN | 650.0 | 60.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| BCP55-10-Q | BCP55-10-QX (934663697115) |
Active | BCP55 /10 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
| BCP55-16-Q | BCP55-16-QF (934663696135) |
Active | BCP55 /16 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_135 |
| BCP55-16-QX (934663696115) |
Active | BCP55 /16 | SOT223_115 | ||||
| BCP55-Q | BCP55-QF (934663695135) |
Active | BCP55 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_135 |
| BCP55-QX (934663695115) |
Active | BCP55 | SOT223_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| BCP55-10-Q | BCP55-10-QX | BCP55-10-Q |
|
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| BCP55-16-Q | BCP55-16-QF | BCP55-16-Q |
|
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| BCP55-16-Q | BCP55-16-QX | BCP55-16-Q |
|
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| BCP55-Q | BCP55-QF | BCP55-Q |
|
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| BCP55-Q | BCP55-QX | BCP55-Q |
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Documentation (7)
| File name | Title | Type | Date |
|---|---|---|---|
| BCP55-Q_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2022-07-01 |
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
| SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Ordering, pricing & availability
Sample
As a Nexperia customer you can order samples via our sales organization.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.