NGD4300
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NGD4300D | NGD4300DJ (935691535118) |
Active | NGD4300 |
SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT96-1_118 |
| NGD4300DD | NGD4300DDJ (935691635118) |
Active | NGD4300 |
HSO8 (SOT8063-1) |
SOT8063-1 | SOT8063-1_118 | |
| NGD4300GC | NGD4300GCJ (935691536118) |
Active | NGD4300 |
HWSON8 (SOT8047-1) |
SOT8047-1 | SOT8047-1_118 |
Documentation (8)
| File name | Title | Type | Date |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
| SOT8063-1 | plastic thermal enhanced small outline package; 8 leads; 1.27 mm pitch;4.9 mm × 3.9 mm ×1.7 mm body; exposed die pad | Package information | 2024-09-24 |
| SOT8047-1 | plastic thermal enhanced very very thin small outline package; no leads;8 terminals; 0.8 mm pitch; 4 x 4 x 0.75 mm body | Package information | 2024-08-21 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
No documents available
Sample
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