74HC590
Parametrics
| Type number | VCC (V) | Output drive capability (mA) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74HC590BQ | 2.0 - 6.0 | ± 5.2 | CMOS | 19 | low | -40~125 | 88 | 10.3 | 56 | DHVQFN16 |
| 74HC590D | 2.0 - 6.0 | ± 5.2 | CMOS | 19 | low | -40~125 | 87 | 7.4 | 46 | SO16 |
| 74HC590PW | 2.0 - 6.0 | ± 5.2 | CMOS | 19 | low | -40~125 | TSSOP16 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HC590BQ | 74HC590BQ,115 (935278834115) |
Active | HC590 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HC590D | 74HC590D,118 (935278827118) |
Active | 74HC590D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC590PW | 74HC590PW,118 (935278836118) |
Active | HC590 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Documentation (19)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC590 | 8-bit binary counter with output register; 3-state | Data sheet | 2024-01-17 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| 001aac543 | Block diagram: 74HC590BQ, 74HC590D, 74HC590N, 74HC590PW | Block diagram | 2009-11-03 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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