CBTD3306
Parametrics
Type number | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|---|
CBTD3306GT | 4.5 - 5.5 | 3.3 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | XSON8 |
CBTD3306PW | 4.5 - 5.5 | 3.3 | TTL | 7 | 300 | 2 | 0.25 | very low | -40~85 | TSSOP8 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
CBTD3306GT | CBTD3306GT,115 (935291421115) |
Active | W06 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
CBTD3306PW | CBTD3306PW,118 (935270512118) |
Active | D306 |
TSSOP8 (SOT530-1) |
SOT530-1 | SOT530-1_118 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
CBTD3306D | CBTD3306D,112 (935270513112) |
Obsolete | CBD3306 |
SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
CBTD3306D,118 (935270513118) |
Obsolete | CBD3306 | SOT96-1_118 | ||||
CBTD3306GM | CBTD3306GM,125 (935291419125) |
Withdrawn / End-of-life | W06 |
XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
CBTD3306GT | CBTD3306GT,115 | CBTD3306GT | ||
CBTD3306PW | CBTD3306PW,118 | CBTD3306PW |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
CBTD3306D | CBTD3306D,112 | CBTD3306D | ||
CBTD3306D | CBTD3306D,118 | CBTD3306D | ||
CBTD3306GM | CBTD3306GM,125 | CBTD3306GM |
Documentation (20)
File name | Title | Type | Date |
---|---|---|---|
CBT3306 | Dual bus switch | Data sheet | 2024-06-06 |
CBTD3306 | Dual bus switch with level shifting | Data sheet | 2024-06-05 |
AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
sa00534 | Block diagram: CBTD3306D, CBTD3306PW | Block diagram | 2009-11-04 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
cbtd3306 | cbtd3306 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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