74LVC1G08-Q100
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G08GM-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | XSON6 | |||
| 74LVC1G08GV-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | 270 | 63.3 | 169 | TSOP5 |
| 74LVC1G08GW-Q100 | 1.65 - 5.5 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 1 | low | -40~125 | TSSOP5 | |||
| 74LVC1G08GZ-Q100 | XSON5 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC1G08GM-Q100 | 74LVC1G08GM-Q100X (935690713115) |
Active | VE |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74LVC1G08GV-Q100 | 74LVC1G08GV-Q100,1 (935298475125) |
Active | V08 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74LVC1G08GW-Q100 | 74LVC1G08GW-Q100,1 (935298476125) |
Active | VE |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74LVC1G08GZ-Q100 | 74LVC1G08GZ-Q100YL (935691687315) |
Active | VE |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC1G08GM-Q100 | 74LVC1G08GM-Q100X | 74LVC1G08GM-Q100 |
|
|
| 74LVC1G08GV-Q100 | 74LVC1G08GV-Q100,1 | 74LVC1G08GV-Q100 |
|
|
| 74LVC1G08GW-Q100 | 74LVC1G08GW-Q100,1 | 74LVC1G08GW-Q100 |
|
|
| 74LVC1G08GZ-Q100 | 74LVC1G08GZ-Q100YL | 74LVC1G08GZ-Q100 |
|
|
Documentation (26)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC1G08_Q100 | Single 2-input AND gate | Data sheet | 2024-09-25 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| mna113 | Block diagram: 74AHC1G08GV, 74AHC1G08GW, 74AHCT1G08GV, 74AHCT1G08GW, 74HC1G08GV, 74HC1G08GW, 74HCT1G08GV, 74HCT1G08GW, 74LVC1G08GF, 74LVC1G08GM, 74LVC1G08GV, 74LVC1G08GW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g08 | 74LVC1G08 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-09-24 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g08 | 74LVC1G08 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
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