74LVCU04A-Q100
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVCU04AD-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 6 | low | -40~125 | SO14 |
74LVCU04APW-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 175 | 6 | low | -40~125 | TSSOP14 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVCU04AD-Q100 | 74LVCU04AD-Q100J (935304498118) |
Active | 74LVCU04AD |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74LVCU04APW-Q100 | 74LVCU04APW-Q100J (935304499118) |
Active | LVCU04A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVCU04AD-Q100 | 74LVCU04AD-Q100J | 74LVCU04AD-Q100 | ||
74LVCU04APW-Q100 | 74LVCU04APW-Q100J | 74LVCU04APW-Q100 |
Documentation (17)
File name | Title | Type | Date |
---|---|---|---|
74LVCU04A_Q100 | Hex unbuffered inverter | Data sheet | 2024-02-28 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lvcu04a | lvcu04a IBIS model | IBIS model | 2013-04-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
lvc | lvc Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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