74AVC4T774-Q100
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AVC4T774BQ-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | DHVQFN16 | |||
| 74AVC4T774GU-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 4 | very low | -40~125 | 99 | 4.1 | 87 | XQFN16 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74AVC4T774BQ-Q100 | 74AVC4T774BQ-Q100X (935691331115) |
Active | C4T774 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74AVC4T774GU-Q100 | 74AVC4T774GU-Q100X (935691332115) |
Active |
XQFN16 (SOT1161-1) |
SOT1161-1 | SOT1161-1_115 | ||
| 74AVC4T774GU-Q100Z (935691332184) |
Active | SOT1161-1_184 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74AVC4T774BQ-Q100 | 74AVC4T774BQ-Q100X | 74AVC4T774BQ-Q100 |
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| 74AVC4T774GU-Q100 | 74AVC4T774GU-Q100X | 74AVC4T774GU-Q100 |
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| 74AVC4T774GU-Q100 | 74AVC4T774GU-Q100Z | 74AVC4T774GU-Q100 |
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Documentation (8)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AVC4T774_Q100 | 4-bit dual supply translating transceiver; 3-state | Data sheet | 2024-06-25 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
| avc4t774 | AVC4T774 IBIS model | IBIS model | 2017-10-04 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT1161-1 | plastic, leadless extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 2.6 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-15 |
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Ordering, pricing & availability
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