NXT4556
SIM card interface level translator
The NXT4556 device is built for interfacing a SIM card with a single low-voltage host side interface. The NXT4556 has three level translators to convert the data, RST and CLK signals between a SIM card and a host microcontroller. A high speed level translation capable of supporting class-B, class-C SIM cards. VCC_SIM power-down initiates a shutdown sequence on SIM card pins in accordance with ISO-7816-3.
The NXT4556 is compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements.
Features and benefits
Support SIM cards and eSIM with supply voltages 1.62 V to 3.3 V
Host micro-controller operating voltage range: 1.08 V to 1.98 V
Automatic level translation of I/O, RST and CLK between SIM card and host side interface with capacitance isolation
Incorporates shutdown feature for the SIM card signals according to ISO-7816-3
High Vdis(UVLO_AC) switching level, arranging quick shut down when VCC_SIM powers down
Integrated pull-up resistors; no external resistor required
Integrated EMI Filters suppresses higher harmonics of digital I/O's
Low current shutdown mode < 1 μA
Supports clock speed beyond 5 MHz clock
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 exceeds 2 kV
CDM ANSI/ESDA/JEDEC JS-002 exceeds 1 kV
IEC61000-4-2 level 4, contact and air discharge on all SIM card-side pins exceeds 8 kV and 15 kV
Available in 9-pin wafer level chip-scale package (WLCSP); 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body; 0.35 mm pitch
Applications
NXT4556 can be used with a range of SIM card attached devices including:
Mobile and personal phones
Wireless modems
SIM card terminals
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| NXT4556UP | 1.08 - 1.98 | 1.62 - 3.3 | CMOS | ± 1 | 20 | 3 | low | -40~85 | WLCSP9 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXT4556UP | NXT4556UPAZ (935691190336) |
Active | z6 |
WLCSP9 (SOT8027-1) |
SOT8027-1 | SOT8027-1_336 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXT4556UP | NXT4556UPZ (935691190084) |
Discontinued / End-of-life | z6 |
WLCSP9 (SOT8027-1) |
SOT8027-1 | Not available |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| NXT4556UP | NXT4556UPAZ | NXT4556UP |
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All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| NXT4556UP | NXT4556UPZ | NXT4556UP |
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Documentation (4)
| File name | Title | Type | Date |
|---|---|---|---|
| NXT4556 | SIM card interface level translator | Data sheet | 2022-06-15 |
| SOT8027-1 | 3D model for products with SOT8027-1 package | Design support | 2023-02-07 |
| nxt4556 | NXT4556 IBIS model | IBIS model | 2021-08-31 |
| SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | Package information | 2022-09-27 |
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Ordering, pricing & availability
Sample
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