Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

High speed optimized Flip Chip Land Grid Array (FC-LGA) package

High speed optimized Flip Chip Land Grid Array (FC-LGA) package

Key features and benefits

Features and benefits

  • Package with lowest internal parasitic to allow for the maximum signal integrity

  • Small package to allow compact system design

  • DFN1006LD-3 package for dual line protection in the same footprint as the single line DFN1006LD-2 package

  • Qualified according to AEC-Q101

  • Up to 15 GHz bandwidth at -0.3 dB

  • Side wettable flanks for AOI options available in single and dual line configurations

Key applications

Applications

Automotive applications:
  • Ultra high-speed data lines such as USB 3.2 or HDMI 2.0

  • Low-Voltage Differential Signaling (LVDS) automotive

  • Automotive Multi-Gigabit Ethernet

  • Automotive A/V monitors, displays and cameras

  • SERDES networks

  • ASA Motion Links

Products

Automotive qualified products (AEC-Q100/Q101)

Type number Description Status Quick access
PESD5V0H2BFG-Q Extremely low clamping bidirectional ESD protection diode Production
PESD5V0H1BLG-Q Extremely low clamping bidirectional ESD protection diode Production
PESD5V0H1BLL-Q Extremely low clamping bidirectional ESD protection diode Production

ESD protection, TVS, filtering and signal conditioning

Type number Description Status Quick access
PESD5V0H2BFG-Q Extremely low clamping bidirectional ESD protection diode Production
PESD5V0H1BLG-Q Extremely low clamping bidirectional ESD protection diode Production
PESD5V0H1BLL-Q Extremely low clamping bidirectional ESD protection diode Production

Documentation

File name Title Type Date
sot8079ld-1_3d.png sot8079ld-1; DFN1006LD-3 Outline 3d 2023-03-10
vp_High_speed_automotive_ESD.zip High speed optimized Flip Chip Land Grid Array (FC-LGA) package Value proposition 2025-03-26

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