74LVC157A-Q100
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name | |||
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC157ABQ-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.5 | low | -40~125 | DHVQFN16 | |||
| 74LVC157AD-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.5 | low | -40~125 | 93 | 10.3 | 53.3 | SO16 |
| 74LVC157APW-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.5 | low | -40~125 | TSSOP16 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC157ABQ-Q100 | 74LVC157ABQ-Q100X (935299278115) |
Active | VC157A |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74LVC157AD-Q100 | 74LVC157AD-Q100J (935299279118) |
Active | 74LVC157AD |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74LVC157APW-Q100 | 74LVC157APW-Q100J (935299281118) |
Active | LVC157A |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74LVC157ADB-Q100 | 74LVC157ADB-Q100J (935301553118) |
Obsolete | VC157A |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC157ABQ-Q100 | 74LVC157ABQ-Q100X | 74LVC157ABQ-Q100 |
|
|
| 74LVC157AD-Q100 | 74LVC157AD-Q100J | 74LVC157AD-Q100 |
|
|
| 74LVC157APW-Q100 | 74LVC157APW-Q100J | 74LVC157APW-Q100 |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74LVC157ADB-Q100 | 74LVC157ADB-Q100J | 74LVC157ADB-Q100 |
|
|
Documentation (23)
| File name | Title | Type | Date |
|---|---|---|---|
| 74LVC157A_Q100 | Quad 2-input multiplexer | Data sheet | 2024-02-12 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc157a | lvc157a IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc157a | lvc157a IBIS model | IBIS model | 2013-04-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
Sample
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