Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| OL-PMCM4401VNE | WLCSP4 | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body | 2015-07-07 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| OL-PMCM4401VNE | 3D model for products with OL-PMCM4401VNE package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-PMCM4401VNE | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.8 mm x 0.8 mm x 0.15 mm body | Package information | 2022-07-13 |
| pmcm4401vne-ssmos_fr | pmcm4401vne-ssmos_fr | Reflow soldering | 2015-07-10 |
Products in this package
MOSFETs
| Type number | Description | Quick access |
|---|---|---|
| PMCM4401VNE | 12V, N-channel Trench MOSFET |