Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8017 | DPAK R2P | Plastic, single-ended surface-mounted package (DPAK R2P); Real-2-Pin configuration; 4.58 mm pitch; 6.16 mm x 6.54 mm x 2.29 mm body | TO-252 (JEDEC) | 2024-01-17 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8017 | 3D model for products with SOT8017 package | Design support | 2023-03-13 |
| SOT8017 | Plastic, single-ended surface-mounted package (DPAK R2P); Real-2-Pin configuration; 4.58 mm pitch; 6.16 mm x 6.54 mm x 2.29 mm body | Package information | 2024-01-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Products in this package
Diodes
| Type number | Description | Quick access |
|---|---|---|
| PSC1065H-Q | 650 V, 10 A SiC Schottky diode in DPAK R2P for automotive applications | |
| PSC1065H | 650 V, 10 A SiC Schottky diode in DPAK R2P | |
| PSC0665H | 650 V, 6 A SiC Schottky diode in DPAK R2P |