Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8055-1 | WLCSP6 | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | 2024-09-27 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8055-1 | WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) | Package information | 2024-11-25 |
| SOT8055-1_336 | WLCSP6; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-09-21 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NEX30606UA | 1.8 V to 5.0 V, 600 mA, 220 nA ultra-low quiescent current, step-down converter |