Package information
Package information | Package name | Package description | Reference | Date |
---|---|---|---|---|
HSO8 | HSO8: Plastic, thermal enhanced small outline package; 8 leads; 1.27 mm pitch; 4.9 mm × 3.9 mm × 1.7 mm body | MS-012 (JEDEC) | 2025-04-09 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
Products in this package
Analog & Logic ICs
Type number | Description | Quick access |
---|---|---|
NEX91515PB-Q100 | ||
NEX91615PB-Q100 | ||
NEX91530PB-Q100 | ||
NEX91630PB-Q100 |