Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

WLCSP25_5X5

WLCSP25_5X5

wafer level chip-size package; 25 bumps; 0.4 mm pitch; 2 x 2 x 0.5 mm body

Package information

Package information Package name Package description Reference Date
WLCSP25_5X5 WLCSP25 wafer level chip-size package; 25 bumps; 0.4 mm pitch; 2 x 2 x 0.5 mm body 2010-02-11

Related documents

File name Title Type Date
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP25_5X5 wafer level chip-size package; 25 bumps; 0.4 mm pitch; 2 x 2 x 0.5 mm body Package information 2020-04-21

Products in this package

ESD protection, TVS, filtering and signal conditioning

Type number Description Quick access