Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8109-1 | HWQFN16 | HWQFN16: plastic thermal enhanced very very thin Quad Flat package; 16 terminals; no leads; 0.65 mm pitch; 4 x 4 x 0.75 mm body | MO-220 (JEDEC) | 2024-12-18 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8109-1 | HWQFN16: plastic thermal enhanced very very thin Quad Flat package; 16 terminals; no leads; 0.65 mm pitch; 4 x 4 x 0.75 mm body | Package information | 2025-02-04 |
| SOT8109-1_518 | HWQFN16; Reel dry pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2025-01-27 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NEX5204100BV | USB Type-C️ and Power Delivery controller |