Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP12_SOT8088 | WLCSP12 | WLCSP12: wafer level chip-size package; 12 bumps (4 x 3) | 2025-01-08 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP12_SOT8088 | WLCSP12: wafer level chip-size package; 12 bumps (4 x 3) | Package information | 2025-01-16 |
| WLCSP12_SOT8088_336 | WLCSP12; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2024-03-28 |
Products in this package
GaN FETs
| Type number | Description | Quick access |
|---|---|---|
| GANB012-040CBA | 40 V, 12 mOhm bi-directional Gallium Nitride (GaN) FET in a 1.2 mm x 1.7 mm Wafer Level Chip-Scale Package (WLCSP) |