Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP16_SOT8087 | WLCSP16 | WLCSP16: wafer level chip-size package; 16 bumps (4 x 4) | 2024-02-19 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP16_SOT8087 | WLCSP16: wafer level chip-size package; 16 bumps (4 x 4) | Package information | 2024-12-05 |
| WLCSP16_SOT8087_341 | WLCSP16; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2024-03-28 |
Products in this package
GaN FETs
| Type number | Description | Quick access |
|---|---|---|
| GANB8R0-040CBA | 40 V, 8.0 mOhm bi-directional Gallium Nitride (GaN) FET in a 1.7 mm x 1.7 mm Wafer Level Chip-Scale Package (WLCSP) |