Discover Nexperia’s extensive portfolio of diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs, IGBTs, and analog & logic ICs. Our components power virtually every electronic design worldwide - from automotive and industrial to mobile and consumer applications.
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WLCSP9: wafer level chip-size package; 9 bumps (3 x 3)
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| WLCSP9_3X3 | WLCSP9 | WLCSP9: wafer level chip-size package; 9 bumps (3 x 3) | 2018-06-06 |
| File name | Title | Type | Date |
|---|---|---|---|
| WLCSP9_3X3 | 3D model for products with WLCSP9_3X3 package | Design support | 2023-03-13 |
| WLCSP9_3X3 | WLCSP9: wafer level chip-size package; 9 bumps (3 x 3) | Package information | 2020-04-21 |
| Type number | Description | Quick access |
|---|