74AVC1T45GM-Q100

Dual-supply voltage level translator/transceiver; 3-state

Automotive qualified

The 74AVC1T45-Q100 is a single bit, dual supply transceiver with 3-state output that enables bidirectional level translation. It features two 1-bit input-output ports (A and B), a direction control input (DIR) and dual supply pins (V_CC(A) and V_CC(B)). Both V_CC(A) and V_CC(B) can be supplied at any voltage between 0.8 V and 3.6 V making the device suitable for translating between any of the low voltage nodes (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V). Pins A and DIR are referenced to V_CC(A) and pin B is referenced to V_CC(B). A HIGH on DIR allows transmission from A to B and a LOW on DIR allows transmission from B to A.

The device is fully specified for partial power-down applications using I_OFF. The I_OFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either V_CC(A) or V_CC(B) are at GND level, both A and B are in the high-impedance OFF-state.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

Automotive product qualification in accordance with AEC-Q100 (Grade 1)
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range:
- V_CC(A): 0.8 V to 3.6 V
- V_CC(B): 0.8 V to 3.6 V
High noise immunity
CMOS low power dissipation
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11( 0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
Maximum data rates:
- 500 Mbit/s (1.8 V to 3.3 V translation)
- 320 Mbit/s (< 1.8 V to 3.3 V translation)
- 320 Mbit/s (translate to 2.5 V or 1.8 V)
- 280 Mbit/s (translate to 1.5 V)
- 240 Mbit/s (translate to 1.2 V)
Suspend mode
Latch-up performance exceeds 100 mA per JESD 78 Class II
Overvoltage tolerant inputs to 3.6 V
Dynamically controlled outputs
Low noise overshoot and undershoot < 10 % of V_CC
I_OFF circuitry provides partial Power-down mode operation
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

Parametrics

Type number	V_CC(A) (V)	V_CC(B) (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	Nr of bits	Power dissipation considerations	T_amb (°C)	Package name
74AVC1T45GM-Q100	0.8 - 3.6	0.8 - 3.6	CMOS/LVTTL	± 12	2.1	1	very low	-40~125	XSON6

PCB Symbol, Footprint and 3D Model

Model Name	Description

Package

Type number	Orderable part number, (Ordering code (12NC))	Status	Marking	Package	Package information	Reflow-/Wave soldering	Packing
74AVC1T45GM-Q100	74AVC1T45GM-Q100H (935299489125)	Active	B5	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_125

Environmental information

Type number	Orderable part number	Chemical content	RoHS	RHF-indicator
74AVC1T45GM-Q100	74AVC1T45GM-Q100H	74AVC1T45GM-Q100

Quality and reliability disclaimer

Series

Documentation (16)

File name	Title	Type	Date
74AVC1T45_Q100	Dual-supply voltage level translator/transceiver; 3-state	Data sheet	2024-07-02
AN10161	PicoGate Logic footprints	Application note	2002-10-29
AN90007	Pin FMEA for AVC family	Application note	2018-11-30
Nexperia_document_guide_MiniLogic_MicroPak_201808	MicroPak leadless logic portfolio guide	Brochure	2018-09-03
SOT886	3D model for products with SOT886 package	Design support	2019-10-03
avc1t45	74AVC1T45 IBIS model	IBIS model	2016-02-24
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904	Automotive logic in MicroPak leadless packages	Leaflet	2019-04-18
Nexperia_package_poster	Nexperia package poster	Leaflet	2020-05-15
sot886_3d_logo	sot886 3D logo	Logo	2018-09-19
DFN1410-6_SOT886_mk	plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Marcom graphics	2017-01-28
XSON6_SOT886_mk	plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Marcom graphics	2017-01-28
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
SOT886_125	XSON6; Reel pack for SMD, 7''; Q3/T4 product orientation	Packing information	2022-12-21
74AVC1T45GM-Q100_Nexperia_Product_Reliability	74AVC1T45GM-Q100 Nexperia Product Reliability	Quality document	2024-06-16
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03

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Models

File name	Title	Type	Date
avc1t45	74AVC1T45 IBIS model	IBIS model	2016-02-24
SOT886	3D model for products with SOT886 package	Design support	2019-10-03

PCB Symbol, Footprint and 3D Model

Model Name	Description

Ordering, pricing & availability

Type number	Orderable part number	Ordering code (12NC)	Status	Packing	Packing Quantity	Buy online
74AVC1T45GM-Q100	74AVC1T45GM-Q100H	935299489125	Active	SOT886_125	5,000	Order product

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