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Click here for more informationBSP130
N-channel vertical D-MOS logic level FET
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using vertical D-MOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only.
Features and benefits
Direct interface to Complementary (C-MOS) transitor and Transistor-Transistor Logic (TTL) devices
Very fast switching
No secondary breakdown
Applications
Line current interruptors in telephone sets
Relay, high-speed and line transformer drivers
Parametrics
Type number | Package version | Package name | Product status | Channel type | VDS [max] (V) | Ptot [max] (W) | Release date |
---|---|---|---|---|---|---|---|
BSP130 | SOT223 | SC-73 | End of life | N | 300 | 1.5 | 2011-01-24 |
Package
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BSP130 | BSP130,115 (934023500115) |
Obsolete | BSP130 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BSP130,135 (934023500135) |
Obsolete | BSP130 | SOT223_135 |
Environmental information
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
BSP130 | BSP130,115 | BSP130 | ||
BSP130 | BSP130,135 | BSP130 |
Documentation (18)
File name | Title | Type | Date |
---|---|---|---|
BSP130 | N-channel enhancement mode vertical D-MOS transistor | Data sheet | 2001-12-10 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11158_ZH | Understanding power MOSFET data sheet parameters | Application note | 2021-01-04 |
AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2017-12-21 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
BSP130 | BSP130 SPICE model | SPICE model | 2012-06-08 |
BSP130_07_03_2012 | BSP130.07_03_2012 Spice parameter | SPICE model | 2012-04-13 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
BSP130 | BSP130 SPICE model | SPICE model | 2012-06-08 |
BSP130_07_03_2012 | BSP130.07_03_2012 Spice parameter | SPICE model | 2012-04-13 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.