Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationBSP32
80 V, 1 A PNP medium power transistor
PNP medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. NPN complements: BSP41 and BSP43.
Features and benefits
High current
High power dissipation capability
AEC-Q101 qualified
Applications
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
Parametrics
Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|
BSP32 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 1300.0 | -80.0 | -1000.0 | 40.0 | 120.0 | 150 | 100.0 | Y |
Package
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BSP32 | BSP32,115 (933981980115) |
Discontinued / End-of-life | BSP32 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
Environmental information
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
BSP32 | BSP32,115 | BSP32 |
Series
Documentation (10)
File name | Title | Type | Date |
---|---|---|---|
BSP31_32_33 | PNP medium power transistors | Data sheet | 1999-04-25 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
BSP32_Nexperia_Product_Reliability | BSP32 Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
BSP32 | BSP32 SPICE model | SPICE model | 2024-08-27 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.