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200 V, 2 A hyperfast PN-rectifier
High power density, hyperfast PN-rectifier with high-efficiency planar technology, encapsulated in a small and flat lead CFP5 (SOD128) Surface-Mounted Device (SMD) plastic package.
Features and benefits
- Reverse voltage VR ≤ 200 V
- Forward current IF ≤ 2 A
- Hyperfast recovery time trr ≤ 25 ns
- Pt doped life time control
- Low inductance
- Small and flat lead SMD plastic package
- Package height typ. 1 mm
- High power capability due to clip-bond technology
- Capable for reflow and wave soldering
- Planar die design
Applications
- General-purpose rectification
- Reverse polarity protection
- Hyperfast switching
- Freewheeling applications
Parametrics
Type number | Package version | Package name | Size (mm) | VR [max] (V) | IF(AV) per diode; [max] (A) | IFSM [max] (A) | VF [max] (mV) | IR [max] (µA) | Configuration | trr [max] (ns) | IF [max] (mA) | Cd [typ] (pF) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ES2DP | SOD128 | CFP5 | 3.8 x 2.5 x 1 | 200.0 | 2.0 | 46.0 | 950.0 | 0.2 | single | 25.0 | 2800.0 | 20.0 | N |
Package
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
ES2DP | ES2DPX (934070394115) |
Obsolete | DN |
CFP5 (SOD128) |
SOD128 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOD128_115 |
Environmental information
All type numbers in the table below are discontinued.
Quality and reliability disclaimerDocumentation (11)
File name | Title | Type | Date |
---|---|---|---|
ES2DP | 200 V, 2 A hyperfast PN-rectifier | Data sheet | 2017-08-25 |
AN90002 | Wave soldering guidelines for flatpack packages | Application note | 2023-11-02 |
Nexperia_document_brochure_CFP_Schottky_rectifier | Schottky rectifiers in CFP packages | Brochure | 2020-01-28 |
Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 | CFP封装的肖特基整流器 | Leaflet | 2022-07-01 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
CFP5_SOD128_mk | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOD128 | plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body | Package information | 2022-05-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
ES2DP | ES2DP SPICE model | SPICE model | 2016-12-01 |
TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
ES2DP | ES2DP SPICE model | SPICE model | 2016-12-01 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.