Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

ES3DP

200 V, 3 A hyperfast PN-rectifier

High power density, hyperfast PN-rectifier with high-efficiency planar technology, encapsulated in a small and flat lead CFP5 (SOD128) Surface-Mounted Device (SMD) plastic package.

This product has been discontinued

Features and benefits

  • Reverse voltage VR ≤ 200 V
  • Forward current IF ≤ 3 A
  • Hyperfast recovery time trr ≤ 25 ns
  • Pt doped life time control
  • Low inductance
  • Small and flat lead SMD plastic package
  • Package height typ. 1 mm
  • High power capability due to clip-bond technology
  • Planar die design
  • Capable for reflow and wave soldering

Applications

  • General-purpose rectification
  • Reverse polarity protection
  • Hyperfast switching
  • Freewheeling applications

Parametrics

Type number Package version Package name Size (mm) VR [max] (V) IF(AV) per diode; [max] (A) IFSM [max] (A) VF [max] (mV) IR [max] (µA) Configuration trr [max] (ns) IF [max] (mA) Cd [typ] (pF) Automotive qualified
ES3DP SOD128 CFP5 3.8 x 2.5 x 1 200.0 3.0 60.0 980.0 0.2 single 25.0 4240.0 27.0 N

Package

All type numbers in the table below are discontinued.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
ES3DP ES3DPX
(934070395115)		 Obsolete DP SOD128
CFP5
(SOD128) 		SOD128 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOD128_115

Environmental information

All type numbers in the table below are discontinued.

Type number Orderable part number Chemical content RoHS RHF-indicator
ES3DP ES3DPX ES3DP rohs rhf
Quality and reliability disclaimer

Documentation (11)

File name Title Type Date
ES3DP 200 V, 3 A hyperfast PN-rectifier Data sheet 2017-08-03
AN90002 Wave soldering guidelines for flatpack packages Application note 2023-11-02
Nexperia_document_brochure_CFP_Schottky_rectifier Schottky rectifiers in CFP packages Brochure 2020-01-28
Nexperia_Document_Leaflet_Schottky_rectifiers_in_CFP_CHN_2022 CFP封装的肖特基整流器 Leaflet 2022-07-01
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
CFP5_SOD128_mk plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body Marcom graphics 2017-01-28
SOD128 plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body Package information 2022-05-27
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
ES3DP ES3DP SPICE model SPICE model 2016-12-01
TN90007 Evaluation of junction temperature and thermal stacks using the virtual junction Technical note 2024-09-02
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

Support

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Models

File name Title Type Date
ES3DP ES3DP SPICE model SPICE model 2016-12-01

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Interactive datasheet