Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

PBSS5612PA

12 V, 6 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

NPN complement: PBSS4612PA.

This product has been discontinued

Alternatives

Features and benefits

  • Low collector-emitter saturation voltage VCEsat
  • High collector current capability IC and ICM
  • Smaller required Printed-Circuit Board (PCB) area than for conventional transistors
  • Exposed heat sink for excellent thermal and electrical conductivity
  • Leadless small SMD plastic package with medium power capability

Applications

  • Loadswitch
  • Battery-driven devices
  • Power management
  • Charging circuits
  • Power switches (e.g. motors, fans)

Parametrics

Type number Package version Package name Size (mm) channel type (e) Ptot (mW) VCEO [max] (V) IC [max] (mA) hFE [min] fT [min] (MHz) Automotive qualified
PBSS5612PA SOT1061 DFN2020-3 2 x 2 x 0.65 PNP 500.0 -12.0 -6000.0 220.0 40.0 N

Package

All type numbers in the table below are discontinued.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
PBSS5612PA PBSS5612PA,115
(934063494115)		 Obsolete A9 SOT1061
DFN2020-3
(SOT1061) 		SOT1061 REFLOW_BG-BD-1
SOT1061_115

Environmental information

All type numbers in the table below are discontinued.

Type number Orderable part number Chemical content RoHS RHF-indicator
PBSS5612PA PBSS5612PA,115 PBSS5612PA rohs rhf rhf
Quality and reliability disclaimer

Documentation (11)

File name Title Type Date
PBSS5612PA 12 V, 6 A PNP low V_CEsat (BISS) transistor Data sheet 2010-05-31
AN11045 Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors Application note 2013-03-04
AN11076 Thermal behavior of small-signal discretes on multilayer PCBs Application note 2021-06-23
SOT1061 3D model for products with SOT1061 package Design support 2022-06-02
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020-3_SOT1061_mk plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1061 plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-05-27
PBSS5612PA_Nexperia_Product_Quality PBSS5612PA Nexperia Product Quality Quality document 2019-05-20
PBSS5612PA_Nexperia_Product_Reliability PBSS5612PA Nexperia Product Reliability Quality document Quality document 2020-03-11
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PBSS5612PA PBSS5612PA SPICE model SPICE model 2024-08-27

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
PBSS5612PA PBSS5612PA SPICE model SPICE model 2024-08-27
SOT1061 3D model for products with SOT1061 package Design support 2022-06-02

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Interactive datasheet