Bipolar transistors

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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

PSMN2R3-100SSJ

N-channel 100 V, 2.3 mOhm Application Specific MOSFET (ASFET) in LFPAK88

In high-power applications, it is common practice to connect two or more MOSFETs in parallel to provide high current capability. Even when the gates are driven from the same gate driver, it can be challenging to ensure that MOSFETs share the load current equally.

Small differences in VGS(th) for individual devices cause the MOSFET with the lowest VGS(th) to turn-on first, taking a larger share of the load current during the dynamic switching phase.

The difference in load current between individual MOSFETs ΔID can be significant often leading to differential heating and potential accelerated failure.

One method to reduce the ΔI between MOSFETs is to select devices with matched VGS(th), but testing & sorting MOSFETs with matched VGS(th) can be a difficult process. VGS(th) is typically measured at ΔID < 1 mA and is influenced by temperature also.

ASFETs with enhanced dynamic current sharing are designed to show significantly improved current sharing with low ΔID when connected in parallel applications, they also deliver improved temperature stability showing lower ΔID due to temperature differences across the PCB.

Features and benefits

  • Removes the need for VGS(th) matching

  • Low ΔID enhances current sharing in parallel applications

  • Less sensitive to temperature differences across the PCB

  • Reduced VGS(th) spread

  • Low RDSon

  • 255 A continuous ID Max

  • Avalanche rated, 100% tested

  • Compact and Reliable 8x8 LFPAK88 package, qualified to 175 °C

Applications

  • Applications using MOSFETs in parallel

  • Applications utilizing MOSFETs with matched VGS(th)

  • High-power motor control

Parametrics

Type number Package version Package name Product status Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 10 V (mΩ) Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 10 V (nC) Ptot [max] (W) Qr [typ] (nC) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PSMN2R3-100SSJ SOT1235 LFPAK88 Development N 1 100 2.3 175 255 17 263 341 121 2.2 N 21400 2670 2023-05-24

Documentation (6)

File name Title Type Date
PSMN2R3-100SSJ N-channel 100 V, 2.3 mOhm ASFET with enhanced dynamic current sharing in LFPAK88 Data sheet 2024-09-23
SOT1235 3D model for products with SOT1235 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
LFPAK88_sot1235_mk plastic, single-ended surface-mounted package (LFPAK88); 4 leads; 2 mm pitch; 8 mm x 8 mm x 1.6 mm body Marcom graphics 2019-04-10
SOT1235 plastic, single-ended surface-mounted package (LFPAK88); 4 leads; 2 mm pitch; 8 mm x 8 mm x 1.6 mm body Package information 2022-05-30
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06

Support

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Models

File name Title Type Date
SOT1235 3D model for products with SOT1235 package Design support 2020-01-22

Ordering, pricing & availability

Sample

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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Interactive datasheet