Bipolar transistors

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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

DHXQFN

Nexperia's DHXQFN is the industry's smallest footprint package in 14, 16, 20 and 24 pin and offers significant space saving on PCB. The small footprint of DHXQFN package enables devices to be placed closer to the bypass capacitor. This can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high frequency applications since the traces between logic device and capacitor are shorter.

Key features and benefits

  • Smallest and thinnest package in 14, 16, 20 and 24.
  • Significant space savings up to 25% on a PCB area compare to competitors’ packages (16 pin package as a reference).
  • 45% of space saving compare to industry standard DQFN package (16 pin package as a reference).
  • Small footprint and thinness of the package make it conducive for space constrained applications.
  • Delivers better performance due to closer placement of supply bypass capacitor C.
  • Control plan in place for process, product & package
  • RoHS and dark-green compliant

Parametric search

DHXQFN
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Products

Analog & Logic ICs

Type number Description Status Quick access
74AVC4T245BZ 4-bit dual supply translating transceiver with configurable voltage translation; 3-state Production
74LVC8T245BZ 8-bit dual supply translating transceiver; 3-state Production
74AVC8T245BZ 8-bit dual supply translating transceiver with configurable voltage translation; 3-state Production
74HC595BZ 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Production
74LVC244ABZ Octal buffer/line driver; 3-state Production
74LVC14ABZ Hex inverting Schmitt trigger with 5 V tolerant input Production
74LVC245ABZ Octal bus transceiver; 3-state Production
74LV14ABZ Hex inverting Schmitt trigger Production

Documentation

File name Title Type Date
sot8014-1_3d.png DHXQFN14: plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm Outline 3d 2021-06-10
2021-0002_NEX_083_DHXQFN_Leaflet_v05.pdf Industry’s smallest and thinnest package in 14, 16, 20 and 24 pins for Standard Logic functions Leaflet 2021-06-29
SOT8016-1.pdf plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm Package information 2023-02-03
SOT8014-1.pdf plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm Package information 2023-02-28
SOT8020-1.pdf plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm Package information 2023-02-28
SOT8024-1.pdf plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm Package information 2023-02-28
vp_DHXQFN.zip DHXQFN Value proposition 2024-10-04

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