74AHC1G02; 74AHCT1G02
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|
74AHC1G02GV | 2.0 - 5.5 | CMOS | ± 8 | 3.2 | 60 | 1 | low | -40~125 | TSOP5 | |||
74AHC1G02GW | 2.0 - 5.5 | CMOS | ± 8 | 3.2 | 60 | 1 | low | -40~125 | TSSOP5 | |||
74AHCT1G02GV | 4.5 - 5.5 | TTL | ± 8 | 3.5 | 60 | 1 | low | -40~125 | 272 | 64.5 | 170 | TSOP5 |
74AHCT1G02GW | 4.5 - 5.5 | TTL | ± 8 | 3.5 | 60 | 1 | low | -40~125 | TSSOP5 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AHC1G02GV | 74AHC1G02GV,125 (935271650125) |
Active | A02 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
74AHC1G02GW | 74AHC1G02GW,125 (935262750125) |
Active | AB |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
74AHCT1G02GV | 74AHCT1G02GV,125 (935271651125) |
Active | C02 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
74AHCT1G02GW | 74AHCT1G02GW,125 (935262751125) |
Active | CB |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AHC1G02GV | 74AHC1G02GV,125 | 74AHC1G02GV | ||
74AHC1G02GW | 74AHC1G02GW,125 | 74AHC1G02GW | ||
74AHCT1G02GV | 74AHCT1G02GV,125 | 74AHCT1G02GV | ||
74AHCT1G02GW | 74AHCT1G02GW,125 | 74AHCT1G02GW |
Documentation (14)
File name | Title | Type | Date |
---|---|---|---|
74AHC_AHCT1G02 | 2-input NOR gate | Data sheet | 2024-09-19 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
ahc1g02 | ahc1g02 IBIS model | IBIS model | 2013-04-08 |
ahct1g02 | ahct1g02 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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