74HC423
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|
74HC423BQ | 2.0 - 6.0 | CMOS | ± 5.2 | 23 | low | -40~125 | 80 | 4.3 | 47 | DHVQFN16 |
74HC423D | 2.0 - 6.0 | CMOS | ± 5.2 | 23 | low | -40~125 | 77 | 2.8 | 35 | SO16 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74HC423BQ | 74HC423BQ,115 (935285428115) |
Active | HC423 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74HC423D | 74HC423D,653 (933714870653) |
Active | 74HC423D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
Not available |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74HC423BQ | 74HC423BQ,115 | 74HC423BQ | ||
74HC423D | 74HC423D,653 | 74HC423D |
Documentation (15)
File name | Title | Type | Date |
---|---|---|---|
74HC423 | Dual retriggerable monostable multivibrator with reset | Data sheet | 2024-03-13 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
001aah799 | Block diagram: 74HC423BQ, 74HC423D, 74HC423N, 74HCT423BQ, 74HCT423D, 74HCT423DB, 74HCT423N, 74HCT423PW | Block diagram | 2009-11-03 |
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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