HEF4067B-Q100
Parametrics
Type number | Configuration | VCC (V) | RON (Ω) | RON(FLAT) (Ω) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
HEF4067BTT-Q100 | SP16T-Z | 3.0 - 15 | 175 | 20 | CMOS | very low | -40~85 | TSSOP24 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
HEF4067BTT-Q100 | HEF4067BTT-Q100J (935691334118) |
Active | HEF4067BT |
TSSOP24 (SOT355-1) |
SOT355-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT355-1_118 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
HEF4067BT-Q100 | HEF4067BT-Q100J (935301625118) |
Discontinued / End-of-life | HEF4067BT |
SO24 (SOT137-1) |
SOT137-1 |
SO-SOJ-WAVE
WAVE_BG-BD-1 |
SOT137-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
HEF4067BTT-Q100 | HEF4067BTT-Q100J | HEF4067BTT-Q100 |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
HEF4067BT-Q100 | HEF4067BT-Q100J | HEF4067BT-Q100 |
Documentation (11)
File name | Title | Type | Date |
---|---|---|---|
HEF4067B_Q100 | 16-channel analog multiplexer/demultiplexer | Data sheet | 2024-07-25 |
AN11051 | Pin FMEA HEF4000 family | Application note | 2019-01-09 |
SOT137-1 | 3D model for products with SOT137-1 package | Design support | 2020-01-22 |
SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT137-1 | plastic, small outline package; 24 leads; 1.27 mm pitch; 15.4 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-21 |
SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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