BCP51-Q series
Parametrics
Type number | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|
BCP51-10-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -45 | -1000 | 63 | 160 | Y |
BCP51-16-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -45 | -1000 | 100 | 250 | Y |
BCP51-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 650 | -45 | -1000 | 100 | 250 | Y |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BCP51-10-Q | BCP51-10-QX (934666364115) |
Active | BCP51 /10 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BCP51-10-QF (934666364135) |
Active | BCP51 /10 | SOT223_135 | ||||
BCP51-16-Q | BCP51-16-QX (934666365115) |
Active | BCP51 /16 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BCP51-16-QF (934666365135) |
Active | BCP51 /16 | SOT223_135 | ||||
BCP51-Q | BCP51-QX (934666360115) |
Active | BCP51 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
BCP51-10-Q | BCP51-10-QX | BCP51-10-Q | ||
BCP51-10-Q | BCP51-10-QF | BCP51-10-Q | ||
BCP51-16-Q | BCP51-16-QX | BCP51-16-Q | ||
BCP51-16-Q | BCP51-16-QF | BCP51-16-Q | ||
BCP51-Q | BCP51-QX | BCP51-Q |
Documentation (7)
File name | Title | Type | Date |
---|---|---|---|
BCP51-Q_SER | 45 V, 1 A PNP medium power transistors | Data sheet | 2023-10-16 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.